have you touched a power pack from a laptop, or xbox360/ps3 after they've been used for 30min?djones wrote:All this talk of holes etc for 'cooling the electronics' that keeps going on in the cars section....
Why would they ever need to?
Sure in the KERS days I could see why but unless these parts are near the hot engine, why would they possibly get hot enough to require cooling?
Fil wrote:have you touched a power pack from a laptop, or xbox360/ps3 after they've been used for 30min?
or the bottom of a laptop, even the back of a tv?
electronics generate heat. household appliances have the luxury of using heatsinks & fans with sufficient space around them to allow for cooling airflow.
an F1 environment is a little more extreme. heatsinks in particular are quite heavy, so a key area of mass-reduction is reducing/removing them completely. this compromises heat-reduction, requiring more air-flow to maintain operating temperatures..
at 200km/h+ there's plenty of air flowing, its just a matter of directing it efficiently past the right components with minimal drag.
tarzoon wrote:Comparing car electronics - even F1 - is not the best example, because the hardware design is completely different.
Fil wrote:yeh fair enough, comparing apples & oranges isn't the best i know.. but they're both still fruit!
speedsense wrote:The electronics need cooling because of external heat caused by radiators, coolers and engine compartments and it's containment inside a "box" along with them.
zmej wrote:Hi everyone, long time reader, first time poster.
Back on topic, the "heart" of all electronics in all F1 cars is TAG-310B (PDF File). (not sure if they use 310B, 210 or 400 module)
As McLaren state, its power consumption when operational is about 40W (~14Vdc/~3Adc) and the internal temperature should not increase 70 deg C. It is not an easy task to accomplish this even it is not heated by other car internals, its cooling is obligatory.
The MPU they use, i believe, is PowerPC 476FP, and for the tasks it is designed, is better than any PC-processor (they are different though). As I can see, they use some weird method for programming - "Application code is autocoded using our Graphical Development Environment (GDE) from Matlab/Simulink control modules." - this adds some overhead for both code and time (this means a directly programmed less powerful MPU should be capable of doing exactly the same work), but the benefit of using their system is that they can change the firmware very fast without the need of highly experienced software developers with thorough knowledge in engine and transmission control.
But there are other electronic units that require cooling (well, may be not all of them), for example ingnition and injection modules: IGN310 and INJ310
In general, electronic components are divided into temperature grades, with general purpose grade 0-70 deg C (rarely used), industrial grade (-20 to 105/125 deg C - lower and upper limits vary upon manufacturer and part), and military grade (-40/60 to +150/+175 - again vary upon manufacturer and part). I doubt if they use anything else than military grade components. Any decent electronic device should be capable of working at 100 deg C, but keep in mind, that the crystal temperature of every heatsink-mounted semiconductor is at least 5 to 20 deg C (and may be more, depending on the design) more than the temperature that you can measure on the heatsink surface.
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